FRACTURE CAUSED by the impact of abrasive grain due to tool vibrating at high frequency (Amplified by tapered horn).SlurryTough and ductile (soft steel)The hard and brittle material, semiconductor, non-metals( eg. Glass and ceramic).Abrasive JET MachiningBrittle fracture by impinging abrasive grains at high speed.Air, CO2Abrasives (Al2O3, ­­SiC),Nozzle (WC, sapphire)Hard and Brittle METAL and non-metallic material.Electric discharge machiningMelting and evaporation, aided by cavitation.Dielectric fluidCopper, brass, graphiteAll conducting metals and alloysElectrochemical machiningElectrolysis (Ion dissolution)Conducting electrolyteCopper, brass, steelAll conducting metals and alloysElectron beam machiningMelting and vapourisationvacuumA beam of an electron moving at high velocityAll material.Laser beam machiningMelting and vapourisationNormal atmosphereA high power laser beam (Ruby ROD)All material.

"> FRACTURE CAUSED by the impact of abrasive grain due to tool vibrating at high frequency (Amplified by tapered horn).SlurryTough and ductile (soft steel)The hard and brittle material, semiconductor, non-metals( eg. Glass and ceramic).Abrasive JET MachiningBrittle fracture by impinging abrasive grains at high speed.Air, CO2Abrasives (Al2O3, ­­SiC),Nozzle (WC, sapphire)Hard and Brittle METAL and non-metallic material.Electric discharge machiningMelting and evaporation, aided by cavitation.Dielectric fluidCopper, brass, graphiteAll conducting metals and alloysElectrochemical machiningElectrolysis (Ion dissolution)Conducting electrolyteCopper, brass, steelAll conducting metals and alloysElectron beam machiningMelting and vapourisationvacuumA beam of an electron moving at high velocityAll material.Laser beam machiningMelting and vapourisationNormal atmosphereA high power laser beam (Ruby ROD)All material.

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The primary mechanism of material removal in electrochemical machining (ECM) is

Current Affairs General Awareness in Current Affairs 8 months ago

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Explanation:The unconventional machining process and their characteristics and the application areas are discussed in the table below:Type Of MachiningMechanics Of Material RemovalMediumTool MaterialMaterial ApplicationUltrasonic machiningBrittle FRACTURE CAUSED by the impact of abrasive grain due to tool vibrating at high frequency (Amplified by tapered horn).SlurryTough and ductile (soft steel)The hard and brittle material, semiconductor, non-metals( eg. Glass and ceramic).Abrasive JET MachiningBrittle fracture by impinging abrasive grains at high speed.Air, CO2Abrasives (Al2O3, ­­SiC),Nozzle (WC, sapphire)Hard and Brittle METAL and non-metallic material.Electric discharge machiningMelting and evaporation, aided by cavitation.Dielectric fluidCopper, brass, graphiteAll conducting metals and alloysElectrochemical machiningElectrolysis (Ion dissolution)Conducting electrolyteCopper, brass, steelAll conducting metals and alloysElectron beam machiningMelting and vapourisationvacuumA beam of an electron moving at high velocityAll material.Laser beam machiningMelting and vapourisationNormal atmosphereA high power laser beam (Ruby ROD)All material.

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Posted on 15 Nov 2024, this text provides information on Current Affairs related to General Awareness in Current Affairs. Please note that while accuracy is prioritized, the data presented might not be entirely correct or up-to-date. This information is offered for general knowledge and informational purposes only, and should not be considered as a substitute for professional advice.

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